About the Role
In this role you'll be responsible to design the next iteration of SEMRON's 3D in-memory compute chip. You will collaborate with a team of hardware, compiler and ML engineers to optimise all aspects of executing ML workloads based on our capacitive analog in-memory matrix-vector multiplication units.
About us
At SEMRON, we’re redefining what’s possible in AI hardware. Our core innovation lies in analog in-memory computing for deep neural network acceleration, enabling us to build compute architectures that scale vertically into the third dimension, much like NAND flash revolutionized memory. This leap in physical density allows us to deploy models with billions of parameters on chip areas as small as a few square millimeters.
